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ESP32-Based IoT PCBA — From Ready Stock to Rapid Mass Production.
Industrial PCBA Assembly Solution for Automation Control Equipment 1
Industrial PCBA Assembly Solution for Automation Control Equipment 1

Industrial PCBA Assembly Solution for Automation Control Equipment

Industry: Industrial Automation
Scope of Service: DFM Review | PCB Fabrication | SMT Assembly | FCT Functional Test | Box Build
Technical Highlights: Wide temperature operation, EMC compliance, 01005 passive components, BGA assembly, conformal coating
  
Final Outcomes & Measurable Value
1. Quality Performance: Prototypes passed EMC and wide-temperature reliability testing. The optimized layout eliminated BGA cold joint defects.
2. Time-to-Market: Delivered fully tested prototype batches in 12 working days, meeting the customer’s retrofit tender deadline.
3. Mass Production Transition: Smooth ramp-up from prototype to monthly volume production. The customer reduced rework cost significantly.
5.0
design customization

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    Client Background & Initial Challenges

    A telecom system integrator is developing an industrial network gateway for data transmission. The motherboard uses a 10-layer high-speed PCB with fine-pitch BGA chips.
    Key Challenges
    Technical: High-speed differential signal integrity with strict impedance tolerance, and dense BGA component assembly risk.


    Manufacturing: High-layer-count PCB with hidden BGA solder joints requiring X-Ray inspection.


    EMC: Shielding design to reduce network signal interference.
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    MTI End-to-End Solution
    High-Speed DFM & SI Review: Signal integrity engineers checked differential pair routing, impedance control and layer stackup to eliminate signal reflection and crosstalk.

    10-Layer High-Speed PCB Fabrication + SMT: Impedance tolerance controlled to ±5% with high-precision placement of 0.4mm pitch BGA chips.

    Multi-Inspection Workflow: AOI plus full 3D X-Ray scan of all BGA solder balls to detect voids and cold joints.
    Functional & EMC Pre-test: Power-up test, high-speed communication test and EMC pre-evaluation.
    Final Outcomes & Measurable Value
    Signal Performance: High-speed communication meets the design specification with no signal integrity issue.

    Assembly Quality: Full X-Ray inspection eliminated hidden BGA soldering defects.

    Project Progress: Gateway motherboard prototypes completed, supporting the customer’s system integration test.

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    Visual Proof & Testimonial
    Client Quote: “High-speed BGA assembly and signal integrity were our biggest hurdles. MTI’s professional DFM and X-Ray inspection ensured our gateway board quality.”

    — 03 · MTI Engineering Approach

    Redesigning the hardware architecture

    Our engineering team focused on:

    Industrial PCBA Assembly Solution for Automation Control Equipment 6
    Nordic BLE module integration
    Our in-house designers and engineers have produced countless great designs for customers from different
    Industrial PCBA Assembly Solution for Automation Control Equipment 7
    Low-power circuit optimization
    Choose us, and we promise to do everything needed to ensure a successful and satisfactory working
    Industrial PCBA Assembly Solution for Automation Control Equipment 8
    Sensor interface design
    We boast offering unmatched, cost-effective manufacture that caters to industry.
    Industrial PCBA Assembly Solution for Automation Control Equipment 9
    PCB layout improvement
    ustomers choose us because we provide leading technology, deliver unmatched products and services.
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    Component selection according to production requirements
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