10-Layer High-Speed PCB Fabrication + SMT: Impedance tolerance controlled to ±5% with high-precision placement of 0.4mm pitch BGA chips.
Multi-Inspection Workflow: AOI plus full 3D X-Ray scan of all BGA solder balls to detect voids and cold joints.Assembly Quality: Full X-Ray inspection eliminated hidden BGA soldering defects.
Project Progress: Gateway motherboard prototypes completed, supporting the customer’s system integration test.
— 03 · MTI Engineering Approach
Our engineering team focused on: